RT info:eu-repo/semantics/article
T1 Thermomechanical Optimization of Three-Dimensional Low Heat Generation Microelectronic Packaging Using the Boundary Element Method
A1 Vallepuga Espinosa, José
A1 Cifuentes Rodríguez, Jaime
A1 Gutiérrez Posada, Víctor
A1 Ubero Martínez, Iván
A2 Mecanica de los Medios Continuos y Teoria de Estructuras
K1 Electrotecnia
K1 Ingeniería de sistemas
K1 Boundary element method
K1 Elastic contact problem
K1 Thermoelastic contact problem
K1 Microelectronic packaging
K1 Variable thermal contact resistance
K1 Thermal interface material
K1 3307.90 Microelectrónica
K1 1207.02 Sistemas de Control
AB [EN]  This paper presents a simulation based on the boundary element method for the optimization of the thermomechanical behavior of three-dimensional microchip-dissipator packaging when the heat generation produced is medium-low. Starting from a basic architecture studied in the literature, different modifications affecting both elastic boundary conditions and the contact interface between the microprocessor and the heatsink are included and studied in order to improve heat dissipation. A nonlinear interface material is included at the interface of both solids. Thus, a thermal contact conductance as a function of the normal contact traction is simulated. Finally, all these improvements in both contact interface and boundary conditions are applied to study the maximum heat generation that this kind of architecture can efficiently dissipate, so that the microchip will not be damaged due to thermal deformations.
PB MDPI
LK https://hdl.handle.net/10612/19200
UL https://hdl.handle.net/10612/19200
NO Vallepuga-Espinosa, J., Cifuentes-Rodríguez, J., Gutiérrez-Posada, V., & Ubero-Martínez, I. (2022). Thermomechanical Optimization of Three-Dimensional Low Heat Generation Microelectronic Packaging Using the Boundary Element Method. Mathematics, 10(11), 1913. https://doi.org/10.3390/MATH10111913
DS BULERIA. Repositorio Institucional de la Universidad de León
RD 13-may-2024