TY  - JOUR 
AU  - Escuela de Ingenierias Industrial, Informática y Aeroespacial
AU  - Vallepuga Espinosa, José
AU  - Cifuentes Rodríguez, Jaime
AU  - Gutiérrez Posada, Víctor
AU  - Ubero Martínez, Iván
AU  - Mecanica de los Medios Continuos y Teoria de Estructuras
DA  - 2022/06/06
UR  - https://hdl.handle.net/10612/19200
AB  - [EN]  This paper presents a simulation based on the boundary element method for the optimization of the thermomechanical behavior of three-dimensional microchip-dissipator packaging when the heat generation produced is medium-low. Starting from a...
LA  - eng
PB  - MDPI
KW  - Electrotecnia
KW  - Ingeniería de sistemas
KW  - Boundary element method
KW  - Elastic contact problem
KW  - Thermoelastic contact problem
KW  - Microelectronic packaging
KW  - Variable thermal contact resistance
KW  - Thermal interface material
TI  - Thermomechanical Optimization of Three-Dimensional Low Heat Generation Microelectronic Packaging Using the Boundary Element Method
DO  - 10.3390/MATH10111913
T2  - Mathematics
VL  - 10
M2  - 1913
ER  -