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Título
Thermomechanical Optimization of Three-Dimensional Low Heat Generation Microelectronic Packaging Using the Boundary Element Method
Autor
Facultad/Centro
Área de conocimiento
Título de la revista
Mathematics
Número de la revista
11
Cita Bibliográfica
Vallepuga-Espinosa, J., Cifuentes-Rodríguez, J., Gutiérrez-Posada, V., & Ubero-Martínez, I. (2022). Thermomechanical Optimization of Three-Dimensional Low Heat Generation Microelectronic Packaging Using the Boundary Element Method. Mathematics, 10(11), 1913. https://doi.org/10.3390/MATH10111913
Editorial
MDPI
Fecha
2022-06-02
Resumen
[EN] This paper presents a simulation based on the boundary element method for the optimization of the thermomechanical behavior of three-dimensional microchip-dissipator packaging when the heat generation produced is medium-low. Starting from a basic architecture studied in the literature, different modifications affecting both elastic boundary conditions and the contact interface between the microprocessor and the heatsink are included and studied in order to improve heat dissipation. A nonlinear interface material is included at the interface of both solids. Thus, a thermal contact conductance as a function of the normal contact traction is simulated. Finally, all these improvements in both contact interface and boundary conditions are applied to study the maximum heat generation that this kind of architecture can efficiently dissipate, so that the microchip will not be damaged due to thermal deformations.
Materia
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